SUM110P04-04L
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SPECIFICATIONS (T J = 25 °C, unless otherwise noted)
Vishay Siliconix
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
V DS
V GS(th)
I GSS
V GS = 0 V, I D = -250 μA
V DS = V GS , I D = -250 μA
V DS = 0 V, V GS = ± 20 V
-40
-1
-3
± 100
V
nA
V DS = -40 V, V GS = 0 V
-1
Zero Gate Voltage Drain Current
I DSS
V DS = -40 V, V GS = 0 V, T J = 125 °C
-50
μA
V DS = -40 V, V GS = 0 V, T J = 175 °C
-250
On-State Drain Current a
I D(on)
V DS = -5 V, V GS = -10 V
V GS = -10 V, I D = -30 A
-120
0.0034
0.0042
A
Drain-Source On-State Resistance a
Forward Transconductance a
R DS(on)
g fs
V GS = -10 V, I D = -30 A, T J = 125 °C
V GS = -10 V, I D = -30 A, T J = 175 °C
V GS = -4.5 V, I D = -20 A
V DS = -15 V, I D = -30 A
20
0.005
0.0063
0.0076
0.0062
?
S
Dynamic b
Input Capacitance
C iss
11 200
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge c
Gate-Source Charge c
Gate-Drain Charge c
Gate Resistance
Turn-On Delay Time c
C oss
C rss
Q g
Q gs
Q gd
R g
t d(on)
V GS = 0 V, V DS = -25 V, f = 1 MHz
V DS = -20 V, V GS = -10 V, I D = -110 A
1650
1200
235
45
65
3
25
350
40
pF
nC
?
Rise Time c
Turn-Off Delay Time c
Fall Time c
t r
t d(off)
t f
V DD = -20 V, R L = 0.18 ?
I D ?? -110 A, V GEN = -10 V, R g = 2.5 ?
30
190
110
45
300
165
ns
Source-Drain Diode Ratings and Characteristics (T C = 25 °C)
b
Continuous Current
Pulsed Current
I S
I SM
-110
-240
A
Forward Voltage a
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
V SD
t rr
I RM(REC)
Q rr
I F = -85 A, V GS = 0 V
I F = -85 A, dI/dt = 100 A/μs
-1
65
-3.7
0.12
-1.5
100
-5.6
0.28
V
ns
A
μC
Notes
a. Pulse test; pulse width ? 300 μs, duty cycle ? 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S13-2478-Rev. D, 09-Dec-13
2
Document Number: 72437
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